BGA PCB Assembly

Pcbamake has been providing BGA assembly, including BGA Rework and BGA Reballing services in the Printed Circuit Board Assembly industry since 2003. With state-of-the-art BGA placement equipment, high-precision BGA assembly processes, cutting-edge X-Ray Inspection equipment, and highly customizable Complete PCB Assembly solutions, you can rely on us to build high quality and high yield BGA boards.

Efficient Use of Space

BGA PCB layout allows us to efficiently use the available space. Hence, we can mount more components and manufacturer lighter devices.

Excellent Thermal and Electrical Performance

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Customer service oriented
Quick to respond
Flexible
Highly productive

Higher Manufacturing Yields

The most BGA PCB design is smaller in size so they are faster to manufacture. Hence, we get higher manufacturing yields and the process becomes more convenient.

Less Damage to Leads

We use solid solder balls for manufacturing BGA leads. Hence, there is a lesser risk that they will get damaged during operation.

Lower Cost

The smaller size and the convenient manufacturing route ensure that we incur lower manufacturing costs. Hence, this process is ideal for mass production.

BGA soldering, BGA Rework & Reballing'

You may have only a few BGAs or fine pitch parts on your PC boards that require PCB assembly for R&D prototyping. We provide a specialized BGA soldering service for testing and evaluation purposes and we can assist you with BGA rework and BGA reballing at an affordable price!

We follow five basic steps to perform BGA rework: component removal, site preparation, solder paste application, BGA replacement, and Reflow Soldering. We guarantee that 100% of your boards will be fully functional when they are returned to you.

BGA Assembly Capability

We have a wealth of experience handling all types of BGAs, including DSBGA and other Complex Components, from micro BGAs (2mmX3mm) to large size BGAs (45 mm); from ceramic BGAs to plastic BGAs. We are capable of placing minimum 0.4 mm pitch BGAs on your PCB.

PBGA (Plastic Ball Grid Array)

PBGA, short for plastic ball grid array, was invented by Motorola and now has received the widest focus and applications.

TBGA (Tape Ball Grid Array)

TBGA, short for tape ball grid array, is capable of effectively shrinking package thickness and providing excellent electrical performance.

CBGA (Ceramic Ball Grid Array)

As is its name defined, CBGA (ceramic ball grid array) packages take advantage of ceramic as substrate material and tin balls (ratio between tin and lead: 10:90) with high melting point.

We first heat the overall assembly.

We use solder balls which have a very controlled amount of solder. So that we can use soldering for heating them. Hence the solder tends to melt. The solder cools down and tends to solidify.
However, the surface tension causes the molten solder to assume appropriate alignment with respect to the circuit board.
Although it is important to carefully choose the composition of the solder alloy and the corresponding soldering temperature. This is because we have to ensure that the solder doesn’t melt completely. Hence, it stays semi-liquid.
Therefore, each ball remains separate from the adjacent ones.

We mostly use X-ray inspection for analyzing the features of BGA PCBs. This technique is known as XRD in the industry and relies on X-rays for unveiling the hidden features of this PCB. This kind of inspection reveals,
1. Solder Joint Position
2. Solder Joint Radius
3. Change in Circular shape
4. Solder Joint Thickness

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