1.Base Material |
FR-4 / High TG FR-4 / Lead free Materials (ROHS Compliant) / Halogen Free material /CEM-3/CEM-1/ /PTFE/ROGERS/ARLON/TACONIC |
2.Layers |
1-40 |
3.Finised inner/outer copper thickness |
1-10OZ |
4.Finished board thickness |
0.2-7.0mm
Tolerance
Board thickness≤1.0mm: +/-0.1mm 1 < Board thickness≤2.0mm: +/-10% Board thickness>2.0mm: +/-8%
|
5.Max panel size |
≤2sides PCB: 600*1500mm Multilayer PCB: 500*1200mm |
6.Min conductor line width/spacing |
Inner layers: ≥3/3mil Outer layers: ≥3.5/3.5mil |
7.Min hole size |
Mechanical hole: 0.15mm Laser hole: 0.1mm
Drilling precision: first drilling
First drilling: 1mil Second drilling: 4mil
|
8.Warpage |
Board thickness≤0.79mm: β≤1.0% 0.80≤Board thickness≤2.4mm: β≤0.7% Board thickness≥2.5mm: β≤0.5% |
9.Controlled Impedance |
+/-5% |
10. Aspect Ratio |
15:1 |
11.Min welding ring |
4mil |
12.Min solder mask bridge |
≥0.08mm |
13.Plugging vias capability |
0.2-0.8mm |
14. Hole tolerance |
PTH: +/-3mil NPTH: +/-2mil |
15.Outline profile |
Rout/ V-cut/ Bridge/ Stamp hole |
16.Surface treatment |
OSP: 0.5-0.5um HASL: 2-40um Lead free HASL: 2-40um ENIG: Au 1-10U’’ ENEPIG: PB 2-5U’’/ Au 1-8U’’ Immersion Tin:0.8-1.2um Immersion silver: 0.1-1.2um Peelable blue mask Carbon ink Gold plating: Au 1-150U’’ |
17. E-testing pass percent |
97% pass for the first time,+/-2%(tolerance) FQC-Physical Lab: Reliability tests |
18.Certificate |
ROHS, ISO9001:2015, ISO13484:2016, IPC3 Standard |