What are the common classifications of PCB
Common classifications and characteristics of PCB
In the electronics industry, printed circuit boards (PCBs) play a vital role as carriers and connectors of electronic components. With the continuous development of science and technology, the types of PCBs are increasing to meet the needs of different fields and application scenarios.
Common classifications and characteristics of PCBs
Classification by substrate material
Rigid PCB: Rigid PCB is the most common type, and its substrate material is usually a hard material such as glass fiber or polyimide. This type of PCB has high mechanical strength and stability and is suitable for most electronic devices. Rigid PCB can be further divided into single-sided board, double-sided board and multi-layer board according to the number of layers.
Flexible PCB: Flexible PCB, also known as FPC, uses flexible materials such as polyimide or polyester film as substrate. Flexible PCB is thin and bendable, and is suitable for application scenarios that require bending or folding, such as mobile phone cameras, wearable devices, etc.
Rigid-flexible PCB: Rigid-flexible PCB combines the advantages of rigid PCB and flexible PCB, with both stability and mechanical strength in the rigid area and bending performance in the flexible area. This type of PCB is usually used in complex electronic devices, such as medical devices, aerospace equipment, etc.
Classification by conductive layer
Single-sided board: Single-sided board is the simplest type of PCB, with only one side covered with a conductive layer (copper foil). This type of PCB is suitable for simple electronic devices, such as home appliances, toys, etc.
Double-sided board: Both sides of the double-sided board are covered with a conductive layer, and the connection of the two conductive layers is achieved through vias. Double-sided boards are suitable for electronic devices of medium complexity, such as computer motherboards, communication equipment, etc.
Multilayer board: Multilayer board is composed of multiple conductive layers and insulating layers alternately stacked, and the electrical connection between the layers is achieved through blind holes, buried holes and through holes. Multilayer boards have the characteristics of high density and high performance, and are suitable for complex electronic devices, such as smartphones, tablets, etc.
Classification by special process
High-frequency PCB: High-frequency PCB is designed with special materials and processes to reduce loss and interference during signal transmission. High-frequency PCB is widely used in wireless communications, radars, satellites and other fields.
Metal-based PCB: Metal-based PCB uses metal materials (such as aluminum, copper, etc.) as substrates, with good heat dissipation performance and mechanical strength. Metal-based PCBs are suitable for high-power, high-temperature electronic devices, such as LED lighting, power modules, etc.
HDI PCB: HDI (high-density interconnect) PCB uses microvias, blind vias, and buried vias to achieve high-density, high-precision electrical connections. HDI PCBs are suitable for miniaturized, high-performance electronic devices, such as smartphones, tablets, etc.
Classification by surface treatment method
Hin-spray PCB: A tin-spray PCB sprays a layer of tin on the surface of the conductive layer to protect the conductive layer and improve soldering performance. Tin-spray PCBs are widely used in processes such as wave soldering and manual soldering.
Gold-plated PCB: A gold-plated PCB covers the surface of the conductive layer with a layer of metal gold to improve conductivity and anti-oxidation. Gold-plated PCBs are suitable for high-end electronic devices, such as aerospace, medical devices, etc.
OSP PCB: OSP (organic solder preservative) PCB uses an organic coating to cover the surface of the conductive layer to protect the conductive layer and improve soldering performance. OSP PCB has the advantages of environmental protection and low cost, and has gradually become the mainstream choice in wave soldering and SMT processes.
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